C-SOL Ceramic Heat Dissipation Materail

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Electronics and LED devices inevitably produce heat while they are running. Heat needs to be removed by conduction, convection and radiation to lower the temperature and maintain stability and reliability of the system. Electronic devices normally use heat sinks which is a thermal conductive material attaching on the surface of the device in order to conduct the heat to the surrounding area. A heat sink consists of a board and many fins. The board links to the device directly and is capable of transferring and conducting heat rapidly. Fins are used for dissipation. By means of increasing the surface area the heat spread by the board is conducted and transferred to the surrounding by convection. By increasing the surface of fins, effect of dissipation becomes better, electronic devices can function efficiently and energy can be saved.

Aluminum heat sinks no longer meet the need of newer products. Porous ceramic heat sinks can now replace aluminum ones.

The smaller, lighter, speedier and more multifunctional 3C products are, the more heat they produce. Dissipation becomes an issue. More power is required in order to remove the heat. Thus aluminum heat sinks are no longer satisfactory and can be replaced by porous ceramic heat sinks. Ceramic heat sinks remove heat by radiation and the advantages include light, thin, high melting point, non-conductive and can be mass produced. In general, ceramic heat sinks are used in superior 3C products and LED light fixtures.

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